US 11,853,500 B2
Touch substrate and touch device
Yu Jiang, Beijing (CN); Ting Zeng, Beijing (CN); Huan Liu, Beijing (CN); Haifeng Hu, Beijing (CN); Heren Gui, Beijing (CN); Yongfei Li, Beijing (CN); and Jian Yang, Beijing (CN)
Assigned to Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/771,916
Filed by Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Jul. 12, 2021, PCT No. PCT/CN2021/105713
§ 371(c)(1), (2) Date Apr. 26, 2022,
PCT Pub. No. WO2022/042082, PCT Pub. Date Mar. 3, 2022.
Claims priority of application No. 202010882334.1 (CN), filed on Aug. 27, 2020.
Prior Publication US 2022/0397998 A1, Dec. 15, 2022
Int. Cl. G06F 3/041 (2006.01); G06F 3/044 (2006.01)
CPC G06F 3/04164 (2019.05) [G06F 3/0446 (2019.05); G06F 2203/04107 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A touch substrate, comprising:
a substrate, which comprises a touch area and a bonding area on one side of the touch area; and
a plurality of pads on the substrate, wherein the plurality of pads are arranged in the bonding area at intervals,
wherein each of the plurality of pads comprises a first metal layer, a second metal layer and a first organic layer, the first metal layer is between the second metal layer and the substrate, the first organic layer is between the first metal layer and the second metal layer, at least one first via is formed in the first metal layer, at least one second via is formed in the first organic layer, an orthographic projection of the at least one first via on the substrate and an orthographic projection of the at least one second via on the substrate do not overlap, a part of the first organic layer is in the at least one first via, and a part of the second metal layer is in contact with the first metal layer through the at least one second via,
wherein the orthographic projection of the at least one first via on the substrate is within an orthographic projection of the pad on the substrate.