CPC G03B 17/55 (2013.01) [G08B 13/19619 (2013.01); H04N 23/52 (2023.01); H05K 7/20472 (2013.01); H05K 7/20509 (2013.01); H04N 23/51 (2023.01); H05K 7/20454 (2013.01)] | 13 Claims |
1. A thermal-control system for a security camera, the thermal-control system comprising:
a first thermal-control subsystem, the first thermal-control subsystem configured to transfer a first quantity of heat to a housing, the first thermal-control subsystem including:
a first thermal interface material, the first thermal interface material located between a system-on-chip integrated circuit device and a first heat sink, the system-on-chip integrated circuit device mounted to a first surface of a first printed circuit board;
a second thermal interface material, the second thermal interface material located between a memory integrated circuit device and the first heat sink, the memory integrated circuit device mounted to the first surface of the first printed circuit board; and
a third thermal interface material, the third thermal interface material located between a second surface of the first printed circuit board and a second heat sink, the second surface of the first printed circuit board opposite the first surface of the first printed circuit board; and
a second thermal-control subsystem, the second thermal-control subsystem configured to transfer a second quantity of heat to the housing, the second thermal-control subsystem including:
a fourth thermal interface material, the fourth thermal interface material located between a second surface of a second printed circuit board and a heat spreader, the second surface of the second printed circuit board opposite a first surface of the second printed circuit board to which a passive infrared sensor integrated circuit device and an image sensor integrated circuit device are mounted.
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