CPC G01R 31/2877 (2013.01) [G05B 15/02 (2013.01)] | 21 Claims |
1. In a tester system comprising a thermal management head and a tester processor, a method of performing thermal management for a device under test (DUT), the method comprising:
placing a first side of an active-thermal interposer of said thermal management head against said DUT;
disposing a cold plate of said thermal management head against a second side of said active thermal interposer,
wherein said DUT comprises a plurality of modules and wherein said active thermal interposer device comprises a plurality of zones, each zone of said plurality of zones corresponding to a respective module of said plurality of modules and operable to be selectively heated;
receiving a respective set of inputs corresponding to each zone of said plurality of zones, wherein said respective set of inputs comprise inputs from the list of inputs comprising:
a temperature of said cold plate;
a temperature of said zone; and
performing a thermal management process on said plurality of modules of said DUT by separately controlling temperature of each zone of said plurality of zones by: 1) controlling a supply of coolant to said cold plate; and 2) individually controlling heat applied by said active thermal interposer device of each zone of said plurality of zones, and
wherein said performing said thermal management process is further implemented by a plurality of thermal processes, wherein each thermal process controls a temperature of a respective zone of said plurality of zones based on a respective set of inputs for said respective zone.
|