US 11,850,874 B2
Micro-transfer printing stamps and components
Tanya Yvette Moore, Hurdle Mills, NC (US); David Gomez, Holly Springs, NC (US); Christopher Andrew Bower, Raleigh, NC (US); Matthew Alexander Meitl, Durham, NC (US); and Salvatore Bonafede, Chapel Hill, NC (US)
Assigned to X Display Company Technology Limited, Dublin (IE)
Filed by X Display Company Technology Limited, Dublin (IE)
Filed on Mar. 30, 2020, as Appl. No. 16/835,159.
Prior Publication US 2021/0300098 A1, Sep. 30, 2021
Int. Cl. B41K 3/04 (2006.01); G03F 7/00 (2006.01); B41F 16/00 (2006.01)
CPC B41K 3/04 (2013.01) [B41F 16/00 (2013.01); G03F 7/0002 (2013.01)] 38 Claims
OG exemplary drawing
 
1. A micro-transfer structure, comprising:
a first stamp comprising a rigid support, an elastomeric bulk layer disposed on the rigid support, and first elastomeric posts disposed on the bulk layer; and
components each having a first side and an opposing second side, wherein the components are adhered to some but not all of the first posts on the first sides of the component, wherein each of the components is adhered to two or more of the first posts; and
a second stamp different from the first stamp, the second stamp comprising a second rigid support, a second elastomeric bulk layer disposed on the second rigid support, and second posts disposed on the second elastomeric bulk layer, wherein the second sides of the components are adhered to the second stamp, and
wherein each component of the components is adhered to fewer second posts of the second stamp than first posts of the first stamp.