CPC B23K 20/10 (2013.01) [A61M 25/001 (2013.01); B22F 1/00 (2013.01); B22F 10/20 (2021.01); B33Y 10/00 (2014.12); A61M 2025/09141 (2013.01); B22F 2999/00 (2013.01); B33Y 80/00 (2014.12); F16B 2200/77 (2023.08)] | 70 Claims |
1. A method of manufacturing one or more devices, the method comprising: obtaining a base portion of a non-shape-memory metal, the non-shape-memory metal having a first base surface; disposing one or more shape-memory metal portions along the first base surface, the one or more shape-memory metal portions having a longitudinal axis, a first portion, and a second portion axially spaced apart from the first portion along the longitudinal axis, wherein the first portion contacts the base portion and the second portion extends from the base portion; joining a first layer of the non-shape-memory metal to the base portion using ultrasonic additive manufacturing to form a non-shape-memory portion, the first layer having a first layer surface and a second layer surface opposite from the first layer surface that is joined to the first base surface, wherein the second layer surface contacts the one or more shape-memory metal portions; and welding the non-shape-memory metal portion to another device that includes the non-shape-memory metal or a different non-shape-memory metal, wherein the one or more devices is a medical implant.
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