US 11,850,675 B2
Method of joining a shape-memory metal to a non-shape-memory metal with ultrasonic additive manufacturing
Boyd Panton, Columbus, OH (US); Marcelo J. Dapino, Columbus, OH (US); Leon M. Headings, Columbus, OH (US); Mark Bryant Gingerich, Columbus, OH (US); and Jennifer L. Morris, Columbus, OH (US)
Assigned to Ohio State Innovation Foundation, Columbus, OH (US)
Filed by Ohio State Innovation Foundation, Columbus, OH (US)
Filed on Sep. 10, 2020, as Appl. No. 17/016,893.
Claims priority of provisional application 62/898,330, filed on Sep. 10, 2019.
Prior Publication US 2021/0069788 A1, Mar. 11, 2021
Int. Cl. B23K 20/10 (2006.01); A61M 25/00 (2006.01); B33Y 10/00 (2015.01); B22F 10/00 (2021.01); B22F 10/20 (2021.01); A61M 25/09 (2006.01); B33Y 80/00 (2015.01); B22F 1/00 (2022.01)
CPC B23K 20/10 (2013.01) [A61M 25/001 (2013.01); B22F 1/00 (2013.01); B22F 10/20 (2021.01); B33Y 10/00 (2014.12); A61M 2025/09141 (2013.01); B22F 2999/00 (2013.01); B33Y 80/00 (2014.12); F16B 2200/77 (2023.08)] 70 Claims
OG exemplary drawing
 
1. A method of manufacturing one or more devices, the method comprising: obtaining a base portion of a non-shape-memory metal, the non-shape-memory metal having a first base surface; disposing one or more shape-memory metal portions along the first base surface, the one or more shape-memory metal portions having a longitudinal axis, a first portion, and a second portion axially spaced apart from the first portion along the longitudinal axis, wherein the first portion contacts the base portion and the second portion extends from the base portion; joining a first layer of the non-shape-memory metal to the base portion using ultrasonic additive manufacturing to form a non-shape-memory portion, the first layer having a first layer surface and a second layer surface opposite from the first layer surface that is joined to the first base surface, wherein the second layer surface contacts the one or more shape-memory metal portions; and welding the non-shape-memory metal portion to another device that includes the non-shape-memory metal or a different non-shape-memory metal, wherein the one or more devices is a medical implant.