US 11,850,069 B1
Wearable device and methods of manufacturing
Denis Mars, San Francisco, CA (US); Simon Ratner, San Francisco, CA (US); and Curt C. von Badinski, San Francisco, CA (US)
Assigned to Oura Health Oy, San Francisco, CA (US)
Filed by Ouraring Inc., San Francisco, CA (US)
Filed on Jun. 21, 2021, as Appl. No. 17/352,923.
Claims priority of provisional application 63/041,012, filed on Jun. 18, 2020.
Int. Cl. A61B 5/01 (2006.01); A61B 5/00 (2006.01); G01K 1/143 (2021.01); G06F 21/32 (2013.01)
CPC A61B 5/6826 (2013.01) [G01K 1/143 (2013.01); G06F 21/32 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A smart ring comprises:
a round shell comprising an external surface, an internal surface, and sidewalls, wherein the external surface defines an outer diameter portion of the smart ring, and wherein the internal surface and the sidewalls bound an interior region that is characterized by a u-shaped cross-section;
a curved power source disposed within the interior region and within a first annulus sector of the smart ring, wherein the curved power source is configured to provide operating power;
a circuit board coupled to the curved power source and disposed within the interior region and within a second annulus sector of the smart ring;
a plurality of electronic components disposed upon the circuit board, wherein the plurality of electronic components comprises:
a temperature sensor configured to provide a plurality of output signals in response to a heat source coupled to the temperature sensor;
a fingerprint sensor configured to provide incoming fingerprint data in response to a fingerprint provided to the fingerprint sensor;
a memory configured to store authorized fingerprint data; and
a processing unit coupled to the temperature sensor and the fingerprint sensor, wherein the processing unit is configured to determine whether the incoming fingerprint data is authenticated in response to the authorized fingerprint data; and
a potting compound disposed within the interior region and encapsulating the curved power source, the circuit board and the plurality of electronic components, wherein the potting compound forms an inner portion of the smart ring, wherein the interior portion of the smart ring is characterized by a first curved portion, a first flat region within a first portion of the second annulus sector, a second flat region within a second portion of the second annulus sector, and a third portion of the second annulus sector disposed between the first flat region and the second flat region;
wherein the fingerprint sensor is disposed below the first flat region; and
wherein the temperature sensor is associated with the second flat region.