US D1,006,613 S
Package
Hyunjun Yang, Seoul (KR); Yunhwan Kim, Seoul (KR); Deokhun Moon, Seoul (KR); and Goeun Lee, Seoul (KR)
Assigned to SPIGEN KOREA CO., LTD., Seoul (KR)
Filed by SPIGEN KOREA CO., LTD., Seoul (KR)
Filed on Jul. 28, 2020, as Appl. No. 29/652,370.
This patent is subject to a terminal disclaimer.
Term of patent 15 Years
LOC (14) Cl. 09 - 03
U.S. Cl. D 9—415
OG exemplary drawing
 
The ornamental design for a package, as shown and described.