US 11,839,065 B2
Temperature equalizing vehicle-mountable device
Yonghai Mao, Dongguan (CN); Zhenming Hu, Hangzhou (CN); Jianqiang Yin, Dongguan (CN); and Xiaofei Li, Dongguan (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Jan. 13, 2022, as Appl. No. 17/574,766.
Application 17/574,766 is a continuation of application No. PCT/CN2020/112120, filed on Aug. 28, 2020.
Claims priority of application No. 201910812636.9 (CN), filed on Aug. 30, 2019.
Prior Publication US 2022/0142010 A1, May 5, 2022
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20872 (2013.01) [H05K 1/0203 (2013.01); H05K 7/20172 (2013.01); H05K 7/20854 (2013.01); H05K 7/20881 (2013.01); H05K 7/20254 (2013.01); H05K 7/20336 (2013.01); H05K 7/20454 (2013.01); H05K 7/20863 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A vehicle-mount able device, wherein the vehicle-mountable device comprises a housing, a first temperature equalization board, a second temperature equalization board, and a PCB, wherein:
the first temperature equalization board and the PCB are fastened inside the housing, the first temperature equalization board is disposed on a first inner wall of the housing, the PCB is disposed on a second inner wall of the housing, and the first inner wall is opposite to the second inner wall;
a first protrusion is disposed on a side of the first temperature equalization board that is facing the PCB, and a first heat pipe is disposed on a side of the first temperature equalization board that is facing the first inner wall;
a first heat emission component is disposed on a side of the PCB and that is facing the first temperature equalization board;
a position of the first protrusion corresponds to a position of the first heat emission component;
the second temperature equalization board is fastened between the PCB and the second inner wall;
a second heat emission component is disposed on a side of the PCB that is facing the second temperature equalization board;
a second heat pipe is disposed on a side of the second temperature equalization board that is facing the second inner wall, and a second protrusion is disposed on a side of the second temperature equalization board that is facing the PCB; and
a position of the second protrusion corresponds to a position of the second heat emission component.