CPC H05K 7/2039 (2013.01) [H04B 10/40 (2013.01)] | 7 Claims |
1. An optical transceiver, comprising:
a housing;
an optical communication module disposed in the housing; and
a heat dissipation component disposed in the housing and in thermal contact with the housing and the optical communication module, wherein the heat dissipation component is a stamped metal plate, wherein the heat dissipation component comprises a bump in thermal contact with the optical communication module, and the bump is raised toward the optical communication module wherein the heat dissipation component comprises a main body and at least one side sheet, the main body comprises the bump, and the at least one side sheet is connected to an edge of the main body; and
at least one heat transfer medium disposed on the at least one side sheet, and the at least one heat transfer medium is in thermal contact with the housing and the at least one side sheet.
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