US 11,839,054 B1
Stack-PCB design and midplane architecture
Brian Toleno, Cupertino, CA (US); Michael Nikkhoo, Saratoga, CA (US); and Patrick Codd, Sammamish, WA (US)
Assigned to Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed by Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed on Sep. 22, 2021, as Appl. No. 17/482,229.
Int. Cl. G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01); H05K 1/14 (2006.01); H05K 7/06 (2006.01); H05K 7/02 (2006.01); H01L 25/065 (2023.01)
CPC H05K 7/20336 (2013.01) [H01L 25/0657 (2013.01); H05K 1/144 (2013.01); H05K 7/023 (2013.01); H05K 7/06 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A stack printed circuit board architecture comprising:
a heat spreader comprising a first side and a second side, the second side being opposite the first side,
a first printed circuit board coupled to the first side of the heat spreader;
a second printed circuit board separate from the first printed circuit board;
one or more complementary elements coupled to the second side of the heat spreader, and
an interposer located at the first side of the heat spreader and interposed between the first printed circuit board and the second printed circuit board, wherein the interposer includes a frame having one or more openings disposed within an interior of the interposer.