US 11,838,802 B2
Slice information processing method and apparatus
Yang Xin, Shanghai (CN); Xiaobo Wu, Shanghai (CN); Weiwei Chong, Shanghai (CN); Fangyuan Zhu, Beijing (CN); and Clarissa Marquezan, Munich (DE)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed on Mar. 26, 2021, as Appl. No. 17/213,514.
Application 17/213,514 is a continuation of application No. PCT/CN2019/107966, filed on Sep. 25, 2019.
Claims priority of application No. 201811143575.3 (CN), filed on Sep. 28, 2018.
Prior Publication US 2021/0219185 A1, Jul. 15, 2021
Int. Cl. H04W 28/24 (2009.01); H04W 28/10 (2009.01); H04W 84/04 (2009.01)
CPC H04W 28/24 (2013.01) [H04W 28/10 (2013.01); H04W 84/042 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
determining, by an access network device, that a slice service level agreement (SLA) has been signed for a first slice and that no slice SLA has been signed for a second slice; and
prioritizing, by the access network device, a user behavior action of the first slice, or deprioritizing a user behavior action of the second slice.