US 11,838,432 B2
Handheld electronic device
Bryan D. Keen, San Francisco, CA (US); Devon A. Monaco, San Jose, CA (US); Sherry Lee, San Jose, CA (US); Ihtesham H. Chowdhury, Sunnyvale, CA (US); Eric N. Nyland, Santa Clara, CA (US); Matthew D. Hill, Santa Clara, CA (US); Arun R. Varma, San Jose, CA (US); Lucy E. Browning, San Francisco, CA (US); Sawyer I. Cohen, Menlo Park, CA (US); Benjamin J. Pope, Mountain View, CA (US); Abhishek Choudhury, San Jose, CA (US); James W. Bilanski, Palo Alto, CA (US); Yaodong Wang, San Jose, CA (US); Daniel J. Morizio, Sunnyvale, CA (US); Nicholas W. Ruhter, San Francisco, CA (US); David A. Karol, Cupertino, CA (US); and Sean M. Gordoni, Santa Clara, CA (US)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Oct. 12, 2020, as Appl. No. 17/068,619.
Claims priority of provisional application 63/047,760, filed on Jul. 2, 2020.
Claims priority of provisional application 62/946,920, filed on Dec. 11, 2019.
Claims priority of provisional application 62/943,199, filed on Dec. 3, 2019.
Prior Publication US 2021/0168226 A1, Jun. 3, 2021
Int. Cl. H05K 1/18 (2006.01); H04M 1/02 (2006.01); H05K 1/11 (2006.01); H05K 5/00 (2006.01); G06F 1/16 (2006.01); H05K 5/02 (2006.01)
CPC H04M 1/0206 (2013.01) [G06F 1/1637 (2013.01); G06F 1/1686 (2013.01); H04M 1/026 (2013.01); H04M 1/0264 (2013.01); H04M 1/0266 (2013.01); H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 5/0047 (2013.01); H05K 5/0086 (2013.01); H05K 5/0217 (2013.01); H04M 2201/38 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A portable electronic device comprising:
a housing defining an internal volume of the portable electronic device;
a battery within the internal volume; and
a circuit board assembly within the internal volume and defining a first portion extending along a first side of the battery and a second portion extending along a second side of the battery, the circuit board assembly comprising:
a first circuit board defining:
a top surface; and
a bottom surface opposite the top surface;
a wall structure soldered to the first circuit board;
a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure, the second circuit board defining an exterior top surface of the circuit board assembly;
an adhesive between the wall structure and the first circuit board and between the wall structure and the second circuit board, the adhesive bonding the first circuit board and the second circuit board to the wall structure;
an electronic component coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure;
a memory module coupled to the exterior top surface of the circuit board assembly;
a first millimeter-wave antenna array coupled to the bottom surface of the first circuit board;
a flexible circuit element; and
a second millimeter-wave antenna array conductively coupled to the flexible circuit element, flexible circuit element soldered to the bottom surface of the first circuit board.