| CPC H02M 7/003 (2013.01) [H05K 7/1427 (2013.01); H05K 7/20218 (2013.01)] | 12 Claims |
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1. A power conversion device comprising:
a semiconductor module having a body portion which has a semiconductor element therein and is formed in a plate shape, and a connection terminal electrically connected to the semiconductor element and protruding from the body portion;
a cooler having a bottom surface, a top surface, and a side surface, the top surface being thermally connected to one surface of the semiconductor module;
a control board for controlling operation of the semiconductor module;
a capacitor module placed on the bottom surface side of the cooler or the top surface side of the cooler, and electrically connected to the semiconductor module;
a cover which stores the semiconductor module and the control board, and stores the capacitor module when the capacitor module is placed on the top surface side, the cover being fixed to the top surface of the cooler;
a case which stores the capacitor module when the capacitor module is placed on the bottom surface side, the case being fixed to the bottom surface of the cooler; and
a connection busbar connecting the connection terminal of the semiconductor module and the capacitor module, wherein
the semiconductor module, the cooler, the control board, and the capacitor module are arranged in an overlapped manner as seen in a direction perpendicular to the top surface of the cooler,
the capacitor module has a capacitor cell, a bottomed tubular capacitor case which stores the capacitor cell and opens on the cooler side, resin sealing the capacitor cell inside the capacitor case, and a capacitor busbar electrically connected to the capacitor cell and exposed to outside from the resin,
the capacitor busbar has an inner extending portion extending to an opening side along an inner surface of a side wall of the capacitor case, an opening-side extending portion extending from an opening-side end of the inner extending portion to an outer side along an opening-side end surface of the side wall, and an outer extending portion extending from an outer end of the opening-side extending portion to a bottom wall side along an outer surface of the side wall, and
the connection busbar extends from the connection terminal of the semiconductor module to an outer surface of the outer extending portion and has a part extending in parallel to an extending direction of the outer extending portion, and the connection busbar has a capacitor connection portion connected to the outer extending portion, at an end of the connection busbar on the outer extending portion side.
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