US 11,837,828 B2
Memory module socket for an information handling system
Bhyrav M. Mutnury, Austin, TX (US); Mark A. Smith, Georgetown, TX (US); and Sandor Farkas, Round Rock, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Oct. 21, 2021, as Appl. No. 17/451,696.
Prior Publication US 2023/0130196 A1, Apr. 27, 2023
Int. Cl. H01R 33/76 (2006.01); H01R 33/96 (2006.01); H01R 12/72 (2011.01)
CPC H01R 33/765 (2013.01) [H01R 12/721 (2013.01); H01R 33/96 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A memory module socket, comprising:
a first member extending between a first end and a second end of the socket, the second end of the socket opposite to the first end of the socket, the first member positioned along a first side of the socket, the first member including:
a plurality of first contact pins, each of the first contact pins including a first contact point and a second contact point, each of the first contact pins extending between a top side and a bottom side of the memory module socket, the top side opposite to the bottom side, the second contact point of each of the first contact pins positioned proximate to the top side of the memory module socket and the first contact point of each of the first contact pins positioned between the top side and the bottom side of the memory module socket;
a plurality of first resistive coatings connecting two or more of the first contact pins to define first groupings of contact pins, the first resistive coatings positioned at an exposed surface of the memory module socket at the top side of the memory module socket;
a plurality of first ribs separating each of the first groupings of first contact pins;
wherein when the first contact pins are in a first position, the second contact points, at the top side of the memory module, of the first contact pins are in contact with respective first resistive coatings, at the top side of the memory module, to complete a termination to ground.