CPC H01L 23/552 (2013.01) [H01F 27/363 (2020.08); H01F 41/005 (2013.01); H01L 25/16 (2013.01)] | 12 Claims |
1. A module comprising:
a substrate including a first main surface;
a first component mounted on the first main surface;
a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin;
a first shield film covering at least a part of the first upper surface of the first sealing resin; and
a second shield film covering and directly contacting a side surface of the first sealing resin and covering a side surface of the substrate,
wherein a step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin, and
wherein the first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.
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