US 11,837,552 B2
Semiconductor package with layer structures, antenna layer and electronic component
Wen-Sung Hsu, Hsin-Chu (TW); Tao Cheng, Hsinchu (TW); Nan-Cheng Chen, Hsin-Chu (TW); Che-Ya Chou, Kaohsiung (TW); Wen-Chou Wu, Hsinchu (TW); Yen-Ju Lu, New Taipei (TW); Chih-Ming Hung, McKinney, TX (US); and Wei-Hsiu Hsu, Hsinchu (TW)
Assigned to MediaTek Inc., Hsin-Chu (TW)
Filed by MediaTek Inc., Hsin-Chu (TW)
Filed on May 19, 2022, as Appl. No. 17/748,308.
Application 17/748,308 is a continuation of application No. 16/994,764, filed on Aug. 17, 2020, granted, now 11,373,957.
Application 16/994,764 is a continuation of application No. 16/163,614, filed on Oct. 18, 2018, granted, now 10,784,206.
Application 16/163,614 is a continuation in part of application No. 15/672,440, filed on Aug. 9, 2017, granted, now 10,186,488.
Application 15/672,440 is a continuation of application No. 15/162,760, filed on May 24, 2016, granted, now 9,761,534.
Claims priority of provisional application 62/587,624, filed on Nov. 17, 2017.
Claims priority of provisional application 62/221,262, filed on Sep. 21, 2015.
Prior Publication US 2022/0352084 A1, Nov. 3, 2022
Int. Cl. H01L 23/373 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H01L 23/051 (2006.01); H01L 25/18 (2023.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2023.01); H01L 23/50 (2006.01); H01L 21/683 (2006.01); H01Q 9/04 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01L 23/14 (2006.01); H01Q 21/06 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/486 (2013.01); H01L 21/4846 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 23/5383 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H01L 25/10 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H01L 25/162 (2013.01); H01L 25/165 (2013.01); H01L 25/50 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01Q 9/0414 (2013.01); H01L 23/145 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81005 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19106 (2013.01); H01Q 21/065 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a first substrate;
a first layer structure;
a second layer structure; and
a first antenna layer formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure;
wherein the first layer structure is formed between the first substrate and the second layer structure, and wherein the first layer structure comprises a second substrate and a first package body, the second substrate has a receiving portion including an electronic component, and the first package body fills up the receiving portion, the first package body encapsulating the electronic component.