CPC H01L 23/10 (2013.01) [G01N 27/28 (2013.01); G01N 27/4167 (2013.01); H01L 21/56 (2013.01); H01L 23/053 (2013.01); H01L 23/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/48225 (2013.01)] | 19 Claims |
1. A device, comprising:
a substrate including a notch formed in a surface of the substrate;
a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die;
a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch; and
a compressed o-ring seal positioned between and vertically aligned with the chemically inert member and the active surface of the semiconductor die such that the compressed o-ring seal, the chemically inert member and the active surface of the semiconductor die overlap from a top view of the device, the compressed o-ring seal circumscribing the electrochemical sensor.
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