US 11,837,513 B2
O-ring seals for fluid sensing
Sebastian Meier, Munich (DE); and Bernhard Peter Lange, Freising (DE)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jul. 17, 2020, as Appl. No. 16/932,128.
Claims priority of provisional application 62/875,369, filed on Jul. 17, 2019.
Prior Publication US 2021/0020528 A1, Jan. 21, 2021
Int. Cl. H01L 23/10 (2006.01); H01L 23/053 (2006.01); H01L 23/16 (2006.01); H01L 21/56 (2006.01); G01N 27/28 (2006.01); G01N 27/416 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/10 (2013.01) [G01N 27/28 (2013.01); G01N 27/4167 (2013.01); H01L 21/56 (2013.01); H01L 23/053 (2013.01); H01L 23/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/48225 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device, comprising:
a substrate including a notch formed in a surface of the substrate;
a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die;
a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch; and
a compressed o-ring seal positioned between and vertically aligned with the chemically inert member and the active surface of the semiconductor die such that the compressed o-ring seal, the chemically inert member and the active surface of the semiconductor die overlap from a top view of the device, the compressed o-ring seal circumscribing the electrochemical sensor.