US 11,837,493 B2
Electrostatic chuck assembly for plasma processing apparatus
Maolin Long, Santa Clara, CA (US); and Weimin Zeng, San Jose, CA (US)
Assigned to Beijing E-Town Semiconductor Technology Co., Ltd., Beijing (CN); and Mattson Technology, Inc., Fremont, CA (US)
Filed by Beijing E-Town Semiconductor Technology Co., Ltd., Beijing (CN); and Mattson Technology, Inc., Fremont, CA (US)
Filed on Apr. 11, 2022, as Appl. No. 17/717,652.
Claims priority of application No. 202110589056.5 (CN), filed on May 28, 2021.
Prior Publication US 2023/0005778 A1, Jan. 5, 2023
Int. Cl. H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) 20 Claims
OG exemplary drawing
 
1. An electrostatic chuck, comprising:
a workpiece support surface configured to support a workpiece during processing; and
a clamping layer including one or more clamping electrodes, the clamping layer including:
a first clamping electrode defining a first clamping zone and a second clamping zone, the first clamping zone and the second clamping zone being separated by a first gap, the first clamping zone and the second clamping zone being electrically connected by at least one electrical connection extending across the first gap; and
a second clamping electrode disposed radially outward from the first clamping electrode, the second clamping electrode defining a third clamping zone and a fourth clamping zone, the third clamping zone and the fourth clamping zone being separated by a second gap, the third clamping zone and the fourth clamping zone being electrically connected by at least one electrical connection extending across the second gap.