US 11,837,481 B2
Wafer chucking monitor
Peter Match, South Setauket, NY (US); and Carlos Alicea, Medford, NY (US)
Assigned to Advanced Energy Industries, Inc., Denver, CO (US)
Filed by Advanced Energy Industries, Inc., Denver, CO (US)
Filed on Dec. 22, 2022, as Appl. No. 18/087,502.
Application 18/087,502 is a continuation of application No. 17/143,960, filed on Jan. 7, 2021, granted, now 11,562,918.
Prior Publication US 2023/0130919 A1, Apr. 27, 2023
Int. Cl. H01T 23/00 (2006.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01); H02N 13/00 (2006.01)
CPC H01L 21/67259 (2013.01) [H01L 21/6833 (2013.01); H01L 22/14 (2013.01); H02N 13/00 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A wafer chucking monitor comprising:
a voltage source configured to provide a voltage to a wafer chuck;
an AC source configured to provide an AC monitoring signal to the wafer chuck via a node between the wafer chuck and the voltage source;
a blocking capacitor arranged between the AC source and the node;
a chucking sensor arranged between the blocking capacitor and the AC source and configured to monitor current and voltage on a low voltage side of the blocking capacitor;
a filter arranged between the node and the voltage source; and
a controller configured to receive the current and voltage from the chucking sensor and ascertain a chucking state.