US 11,837,409 B2
Ceramic electronic device and manufacturing method of ceramic electronic device
Koichiro Morita, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Feb. 1, 2022, as Appl. No. 17/590,059.
Claims priority of application No. 2021-054207 (JP), filed on Mar. 26, 2021.
Prior Publication US 2022/0310323 A1, Sep. 29, 2022
Int. Cl. H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); C04B 35/468 (2006.01); C04B 35/64 (2006.01); H01G 4/008 (2006.01); C04B 35/06 (2006.01)
CPC H01G 4/1227 (2013.01) [C04B 35/06 (2013.01); C04B 35/4682 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01); C04B 2235/658 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A ceramic electronic device comprising:
a plurality of dielectric layers of which a main component is a ceramic having a perovskite structure; and
a plurality of internal electrode layers, each of which is alternatively stacked with each of the plurality of dielectric layers and includes metal crystal grains, and a co-material which is inactive against the main component of the plurality of dielectric layers, without including a ceramic having a same composition as the ceramic of the main component of the plurality of dielectric layers.