US 11,835,765 B2
Silicon photonics device for LIDAR sensor and method for fabrication
Sen Lin, Santa Clara, CA (US); and Andrew Steil Michaels, Santa Clara, CA (US)
Assigned to Aurora Operations, Inc., Mountain View, CA (US)
Filed by Aurora Operations, Inc., Mountain View, CA (US)
Filed on Oct. 31, 2022, as Appl. No. 18/051,337.
Application 18/051,337 is a continuation of application No. 17/535,024, filed on Nov. 24, 2021, granted, now 11,513,289.
Prior Publication US 2023/0161105 A1, May 25, 2023
Int. Cl. G02B 6/12 (2006.01); G02B 6/136 (2006.01); G01S 7/481 (2006.01)
CPC G02B 6/136 (2013.01) [G01S 7/4816 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12107 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for fabricating a silicon photonics device in a LIDAR sensor system for a vehicle, the method comprising:
obtaining a substrate member and forming a first silicon structure that is coupled to the substrate member;
forming a first oxide layer on the first silicon structure;
forming a metal layer on the first oxide layer and the first silicon structure; and
forming an adhesion layer on the metal layer, the adhesion layer configured to act as a diffusion barrier and adhere to the metal layer, the adhesion layer and the metal layer forming a reflective mirror structure in the silicon photonics device.