US 11,835,414 B2
Passive pressure sensor with a piezoelectric diaphragm and a non-piezoelectric substrate
Viktor Plesski, Gorgier (CH); Soumya Yandrapalli, Lausanne (CH); Julius Koskela, Helsinki (FI); and Ventsislav Yantchev, Sofia (BG)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by MURATA MANUFACTURING CO., LTD, Kyoto (JP)
Filed on Jul. 8, 2021, as Appl. No. 17/370,727.
Application 17/370,727 is a continuation in part of application No. 16/664,398, filed on Oct. 25, 2019, granted, now 11,143,561.
Claims priority of provisional application 62/775,594, filed on Dec. 5, 2018.
Prior Publication US 2021/0333166 A1, Oct. 28, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G01L 9/08 (2006.01); G01L 19/08 (2006.01); G01L 9/00 (2006.01); H03H 9/17 (2006.01)
CPC G01L 9/0022 (2013.01) [G01L 19/086 (2013.01); H03H 9/174 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A pressure-sensitive acoustic resonator, comprising:
a conductor pattern on a planar surface of a non-piezoelectric substrate, the conductor pattern including an interdigital conductor pattern (ICP); and
a piezoelectric diaphragm having a front surface exposed to an environment and a back surface facing, but not contacting, the ICP, such that the back surface of the piezoelectric diaphragm is separated from the ICP by a gap,
wherein the piezoelectric diaphragm does not include a conductor pattern directly disposed on either the front surface or the back surface thereof,
wherein the conductor pattern comprises a single set of interleaved fingers on one surface of the non-piezoelectric substrate, and
wherein the acoustic resonator is configured as a film bulk acoustic resonator.