US 11,835,412 B2
Delicate work tool digitalization system
Hiroyuki Yoshimoto, Tokyo (JP); Ryotaro Kawahara, Tokyo (JP); Ryohei Matsui, Tokyo (JP); Nobuyuki Sugii, Tokyo (JP); Tsuneya Kurihara, Tokyo (JP); Hirohiko Sagawa, Tokyo (JP); Naoko Ushio, Tokyo (JP); Motoki Tajima, Tokyo (JP); and Shingo Kirita, Tokyo (JP)
Assigned to Hitachi, Ltd., Tokyo (JP)
Filed by Hitachi, Ltd., Tokyo (JP)
Filed on Jun. 11, 2021, as Appl. No. 17/345,354.
Claims priority of application No. 2020-110193 (JP), filed on Jun. 26, 2020.
Prior Publication US 2021/0404895 A1, Dec. 30, 2021
Int. Cl. G01L 5/16 (2020.01); G01B 7/16 (2006.01); G01L 5/00 (2006.01)
CPC G01L 5/16 (2013.01) [G01B 7/18 (2013.01); G01L 5/0095 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A digitalization system, comprising:
a first sensor mounted on a work tool and which detects a deformation of the work tool when the work tool is pressed against a work target;
a second sensor which detects a force applied to the work target or a force applied to the work tool when the work tool is pressed against the work target;
a computer which calculates an angle of a corner formed with the work tool and the work target based on sensor values acquired with the first sensor, and calculates a force applied to the work target when the work tool is pressed against the work target based on sensor values acquired with the second sensor; and
a stand on which the work target can be mounted, the stand comprises at least one of a concave part in which the work target can be attached thereto and detached therefrom or a mechanism for vacuum-sucking the work target,
wherein the second sensor is provided to a bottom part of the stand, and
wherein the second sensor detects, as the force applied to the work target, a force of the stand pressing a work table on which the stand is placed.