US 11,834,554 B2
Conductive silicone composition and cured product thereof
Satoru Endo, Tokyo (JP); Hitoshi Mafune, Tokyo (JP); and Takashi Suzuki, Tokyo (JP)
Assigned to THREEBOND CO., LTD., Tokyo (JP)
Appl. No. 17/048,335
Filed by THREEBOND CO., LTD., Tokyo (JP)
PCT Filed Apr. 24, 2019, PCT No. PCT/JP2019/017495
§ 371(c)(1), (2) Date Oct. 16, 2020,
PCT Pub. No. WO2019/220902, PCT Pub. Date Nov. 21, 2019.
Claims priority of application No. 2018-093517 (JP), filed on May 15, 2018.
Prior Publication US 2021/0163688 A1, Jun. 3, 2021
Int. Cl. C08G 77/12 (2006.01); C08G 77/08 (2006.01); C08G 77/20 (2006.01); C08G 77/00 (2006.01); C08K 3/08 (2006.01); C08K 5/541 (2006.01); C08K 7/18 (2006.01); C08L 83/04 (2006.01); H01B 1/22 (2006.01)
CPC C08G 77/12 (2013.01) [C08G 77/08 (2013.01); C08G 77/20 (2013.01); C08G 77/70 (2013.01); C08K 3/08 (2013.01); C08K 5/541 (2013.01); C08K 7/18 (2013.01); C08L 83/04 (2013.01); H01B 1/22 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01)] 10 Claims
 
1. A conductive silicone composition containing (A) to (E) components described below and containing greater than or equal to 10 parts by mass and less than 100 parts by mass of the (D) component with respect to 100 parts by mass of the (A) component:
(A) component: a polyorganosiloxane having one or more alkenyl groups in a molecule
(B) component: a compound having a hydrosilyl group
(C) component: a hydrosilylation catalyst
(D) component: a silane compound having an epoxy group and an alkoxysilyl group
(E) component: a conductive powder,
wherein the (B) component is a compound having a constituting unit represented by Formula (1):

OG Complex Work Unit Chemistry
and
the (E) component is a metal particle consisting of one or more metals selected from the group consisting of gold, silver, copper, nickel, palladium, platinum, tin, and bismuth, or an alloy particle consisting of a combination of a plurality of these metals.