US 11,834,328 B2
Semiconductor package with built-in vibration isolation, thermal stability, and connector decoupling
Hamid Eslampour, San Jose, CA (US); Karthik Katingari, San Jose, CA (US); and Adam Martin, San Jose, CA (US)
Assigned to InvenSense, Inc., San Jose, CA (US)
Filed by InvenSense, Inc., San Jose, CA (US)
Filed on Mar. 15, 2021, as Appl. No. 17/202,070.
Claims priority of provisional application 63/045,368, filed on Jun. 29, 2020.
Prior Publication US 2021/0403318 A1, Dec. 30, 2021
Int. Cl. B81B 7/00 (2006.01); B81C 3/00 (2006.01)
CPC B81B 7/0058 (2013.01) [B81C 3/001 (2013.01); B81B 2207/012 (2013.01); B81B 2207/098 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/032 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A package comprising:
a base comprising a first portion surrounded by a second portion;
an elastomer pad on the first portion;
a sub-assembly on the elastomer pad;
a connector assembly including a first electrical connector positioned in an opening in the base, a second electrical connector on the sub-assembly, and a flexible electrical connection electrically connected to the first electrical connector at a first connection point and electrically connected to the second electrical connector at a second connection point;
a connection seal hermetically sealing the first connection point of the first electrical connector in the opening between the flexible electrical connector and the first portion of the base; and
a lid attached to at least the second portion, the lid forming a hermetically-sealed cavity defined by an upper surface of the first portion, the connector assembly, and an inner surface of the lid.