US 11,833,817 B2
Liquid ejection head substrate and liquid ejection head
Seiko Minami, Saitama (JP); Kenji Takahashi, Kanagawa (JP); and Mai Hirohara, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Nov. 8, 2021, as Appl. No. 17/521,629.
Claims priority of application No. 2020-189848 (JP), filed on Nov. 13, 2020.
Prior Publication US 2022/0153026 A1, May 19, 2022
Int. Cl. B41J 2/14 (2006.01)
CPC B41J 2/14129 (2013.01) [B41J 2/14032 (2013.01); B41J 2202/03 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A liquid ejection head substrate comprising:
a flow passage forming member having an ejection orifice and a flow passage;
a heating resistance element for ejecting a liquid;
an insulating layer covering the heating resistance element;
a conductive protecting layer provided on or above the insulating layer and whose surface is exposed to the flow passage; and
an intermediate layer provided between the flow passage forming member and the conductive protecting layer, wherein
the intermediate layer contains a material represented by the following composition formula (I):
Siw1Ox1Cy1  (I)
in formula (I), 39≤w1≤62 at. %, 32≤x1≤55 at. %, 6≤y1≤29 at. %, and w1+x1+y1=100 at %.