US 11,833,795 B2
Multilayer body and method for producing flexible device
Kaya Tokuda, Otsu (JP); Tetsuo Okuyama, Otsu (JP); Satoshi Maeda, Otsu (JP); Naoki Watanabe, Otsu (JP); Harumi Yonemushi, Otsu (JP); and Denichirou Mizuguchi, Otsu (JP)
Assigned to TOYOBO CO., LTD., Osaka (JP)
Appl. No. 17/996,745
Filed by TOYOBO CO., LTD., Osaka (JP)
PCT Filed Jun. 9, 2021, PCT No. PCT/JP2021/021947
§ 371(c)(1), (2) Date Oct. 20, 2022,
PCT Pub. No. WO2022/018994, PCT Pub. Date Jan. 27, 2022.
Claims priority of application No. 2020-124589 (JP), filed on Jul. 21, 2020; and application No. 2020-124591 (JP), filed on Jul. 21, 2020.
Prior Publication US 2023/0150252 A1, May 18, 2023
Int. Cl. B32B 37/02 (2006.01); B32B 7/022 (2019.01); B32B 7/06 (2019.01); B32B 9/04 (2006.01); B32B 27/28 (2006.01); B32B 38/10 (2006.01); B32B 37/00 (2006.01)
CPC B32B 37/02 (2013.01) [B32B 7/022 (2019.01); B32B 7/06 (2013.01); B32B 9/045 (2013.01); B32B 27/281 (2013.01); B32B 38/10 (2013.01); B32B 2037/0092 (2013.01); B32B 2307/306 (2013.01); B32B 2307/51 (2013.01); B32B 2307/538 (2013.01); B32B 2307/748 (2013.01); B32B 2457/00 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A first laminate of a first highly heat-resistant film and an inorganic substrate, wherein an adhesive is not substantially used and the first laminate has the following features (1) to (5):
(1) a tensile elasticity of the first highly heat-resistant film is 4 GPa or more;
(2) an adhesive strength between the first highly heat-resistant film and the inorganic substrate is 0.3 N/cm or less;
(3) a surface roughness Ra of a surface in contact with the inorganic substrate of the first highly heat-resistant film is 5 nm or less;
(4) a surface roughness Ra of a surface of the inorganic substrate after the first highly heat-resistant has been peeled off film from the first laminate is 3 nm or less; and
(5) a nitrogen element component ratio on a surface to be bonded to the first highly heat-resistant film of the inorganic substrate is 0.2 at % or more and 12 at % or less.