US 11,833,743 B2
3D printer for photopolymerizing a photosensitive plastic resin using a lighting pattern
Markus Klug, Ingolstadt (DE); Tobias Moll, Ingolstadt (DE); and Johannes Scheuchenpflug, Baar-Ebenhausen (DE)
Assigned to AUDI AG, Ingolstadt (DE)
Appl. No. 17/608,397
Filed by AUDI AG, Ingolstadt (DE)
PCT Filed Apr. 30, 2020, PCT No. PCT/EP2020/062111
§ 371(c)(1), (2) Date Nov. 2, 2021,
PCT Pub. No. WO2020/225122, PCT Pub. Date Nov. 12, 2020.
Claims priority of application No. 10 2019 206 367.5 (DE), filed on May 3, 2019.
Prior Publication US 2022/0203608 A1, Jun. 30, 2022
Int. Cl. B29C 64/264 (2017.01); B29C 64/129 (2017.01); B33Y 30/00 (2015.01); B29C 64/245 (2017.01)
CPC B29C 64/129 (2017.08) [B29C 64/245 (2017.08); B29C 64/264 (2017.08); B33Y 30/00 (2014.12)] 12 Claims
OG exemplary drawing
 
1. A 3D printing apparatus for photopolymerizing a photosensitive synthetic resin using an exposure pattern, the 3D printing apparatus comprising:
a synthetic resin bath in which the photosensitive synthetic resin is provided;
a lifting apparatus, wherein the photosensitive synthetic resin at the lifting apparatus is polymerizable by light of a specified wavelength as a hardened body, the lifting apparatus being configured to move the hardened body up and out of the synthetic resin bath to change an exposure plane for the photosensitive synthetic resin with respect to the hardened body;
a carrier medium configured to transmit as a light guide light by internal reflection, and including a coupling-in region and a coupling-out region which are disposed in different sections of the carrier medium; and
an illumination apparatus configured to emit the light onto the coupling-in region,
wherein
the coupling-in region includes a coupling-in deflection structure configured to couple light of the specified wavelength that is incident on the coupling-in deflection structure from the illumination apparatus, into the carrier medium in a direction of the coupling-out region, and
the coupling-out region is disposed below the synthetic resin bath and includes a coupling-out deflection structure configured to couple the light of the specified wavelength that is incident on the coupling-out deflection structure, as an exposure pattern, out of the carrier medium onto the photosensitive synthetic resin of the synthetic resin bath to photopolymerize the photosensitive synthetic resin.