US 11,833,638 B2
CMP polishing pad with polishing elements on supports
John R. McCormick, Exton, PA (US); and Bryan E. Barton, Lincoln University, PA (US)
Assigned to Rohm and Haas Electronic Materials Holding, Inc., Newark, DE (US)
Filed by Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US)
Filed on Mar. 25, 2020, as Appl. No. 16/829,046.
Prior Publication US 2021/0299817 A1, Sep. 30, 2021
Int. Cl. B24B 37/26 (2012.01); B24B 37/22 (2012.01)
CPC B24B 37/26 (2013.01) [B24B 37/22 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A polishing pad useful in chemical mechanical polishing comprising:
a base pad having a top surface,
a plurality of polishing elements each having a top polishing surface and a bottom surface, and
wherein each of the plurality of polishing elements is connected to the top surface of the base pad to the polishing element by three or more straight supports wherein the straight supports are in a single layer and are spaced apart from each other at the polishing element and at the base pad, the three or more straight supports are at a peripheral edge of the polishing element and extend outward beyond the peripheral edge at an angle 10 to 50 degrees from perpendicular to the polishing element, and wherein the bottom surface of the polishing element, the top surface of the base pad and the straight supports define a region comprising at least one void and there are openings between the three or more straight supports.