	US 11,833,622 B2
	Flux and solder paste
Takeshi Yahagi, Tokyo (JP); Noriyoshi Uchida, Tokyo (JP); and Yuri Misumi, Tokyo (JP)
Assigned to KOKI Company Limited, Tokyo (JP)
Appl. No. 17/266,146
Filed by KOKI Company Limited, Tokyo (JP)
PCT Filed Jul. 24, 2019, PCT No. PCT/JP2019/028961 § 371(c)(1), (2) Date Feb. 5, 2021, PCT Pub. No. WO2020/031693, PCT Pub. Date Feb. 13, 2020.
Claims priority of application No. 2018-151648 (JP), filed on Aug. 10, 2018.
Prior Publication US 2021/0291304 A1, Sep. 23, 2021
Int. Cl. B23K 35/362 (2006.01); B23K 35/02 (2006.01); B23K 35/36 (2006.01); B23K 103/08 (2006.01); B23K 35/26 (2006.01)

CPC B23K 35/362 (2013.01) [B23K 35/025 (2013.01); B23K 35/3613 (2013.01); B23K 35/3618 (2013.01); B23K 35/262 (2013.01); B23K 2103/08 (2018.08)]

5 Claims

1. A flux comprising:

a solvent; and

a thixotropic agent,

the solvent comprising a carboxylic acid that is liquid at ordinary temperature, wherein a content of the carboxylic acid is 20.0 to 70.0% by mass based on an entirety of the flux and the flux further comprises 0.1% or more and 10% or less by mass of an organic acid-based activator based on an entirety of the flux, and

the carboxylic acid has an acid number of 355 mgKOH/g or more.