CPC B23H 7/24 (2013.01) [B22F 10/28 (2021.01); B22F 10/66 (2021.01); B28B 3/269 (2013.01); B29C 48/3001 (2019.02); B29C 48/32 (2019.02); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12); B22F 10/25 (2021.01); B22F 10/36 (2021.01); B22F 10/38 (2021.01); B22F 10/62 (2021.01); B22F 2301/10 (2013.01); B22F 2301/20 (2013.01); B22F 2304/10 (2013.01)] | 17 Claims |
1. A method for additively manufacturing a copper-tungsten electrode, the method comprising:
forming an electrode as a series of layers, wherein each layer is formed by:
depositing a layer of powder on a manufacturing platform or a previous layer in the series, wherein the layer of powder comprises a tungsten powder and a copper powder; and
fusing the layer of powder using a laser to apply a laser energy of about 1 to about 10 J/mm2 to the layer of powder;
wherein the electrode is comprised of an interconnected network of tungsten infiltrated by copper formed by the series of layers fused together; and
smoothing the electrode using a secondary electrode in a plunge electrical discharge machining process.
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