US 10,497,847 B2
Structure and manufacturing method of heat dissipation substrate and package structure and method thereof
Wen-Fang Liu, Taoyuan (TW); Shao-Chien Lee, Taipei (TW); Chen-Wei Tseng, New Taipei (TW); and Zong-Hua Li, Taoyuan (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Nov. 30, 2017, as Appl. No. 15/826,702.
Claims priority of application No. 106129499 A (TW), filed on Aug. 30, 2017.
Prior Publication US 2019/0067543 A1, Feb. 28, 2019
Int. Cl. H01L 33/00 (2010.01); H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01)
CPC H01L 33/642 (2013.01) [H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/647 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A heat dissipation substrate structure, comprising:
a multilayer circuit board comprising a core board and a plurality of build-up boards, wherein each of the build-up boards is respectively disposed on two surfaces of the core board;
at least one heat conduction layer embedded in the core board, the heat conduction layer has a first surface and a second surface opposite to the first surface, and the first surface and the second surface are coplanar with two surfaces of the core board respectively;
at least one cavity structure formed in the multilayer circuit board with respect to the at least one heat conduction layer and exposing the first surface of the at least one heat conduction layer;
a plurality of bonding pads disposed on a surface of the multilayer circuit board at a side of the second surface of the at least one heat conduction layer; and
a plurality of vias formed in the multilayer circuit board, wherein at least a portion of the vias is connected to a portion of the bonding pads and the second surface of the at least one heat conduction layer.