US 9,832,885 B2
Circuit board, electronic component and method of manufacturing circuit board
Myung Sam Kang, Suwon-Si (KR); Ki Jung Sung, Suwon-Si (KR); Seung Yeop Kook, Suwon-Si (KR); and Seung Eun Lee, Suwon-Si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do (KR)
Filed on May 26, 2015, as Appl. No. 14/722,084.
Claims priority of application No. 10-2014-0063045 (KR), filed on May 26, 2014.
Prior Publication US 2015/0342047 A1, Nov. 26, 2015
Int. Cl. H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 1/11 (2006.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01)
CPC H05K 3/40 (2013.01) [H05K 1/09 (2013.01); H05K 1/114 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H05K 3/188 (2013.01); H05K 3/244 (2013.01); H05K 2203/049 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49156 (2015.01)] 10 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a first insulating layer;
a circuit pattern disposed on an upper surface of the first insulating layer and comprising a circuit patter portion and a connection pad portion;
a second insulating layer made of a solder resist and formed on the first insulating layer and the circuit pattern so as to cover the circuit pattern, the second insulating layer having an opening formed therein to expose at least a portion of the connection pad portion; and
a contact pad formed on an upper surface of the second insulating layer and on an inner wall of the opening, one end of the contact pad being in contact with the connection pad portion to be electrically connected to the connection pad portion.