US 10,485,105 B2
Substrate and method for manufacturing the same
Yong Sam Lee, Suwon-si (KR); and Won Joong Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do (KR)
Filed on Sep. 22, 2017, as Appl. No. 15/712,787.
Claims priority of application No. 10-2017-0021721 (KR), filed on Feb. 17, 2017.
Prior Publication US 2018/0242453 A1, Aug. 23, 2018
Int. Cl. H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 1/111 (2013.01); H05K 1/112 (2013.01); H05K 3/0038 (2013.01); H05K 3/0094 (2013.01); H05K 1/113 (2013.01); H05K 3/0055 (2013.01); H05K 3/427 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A substrate, comprising:
a core layer having a tapered through hole extending therethrough between first and second opposing surfaces thereof, the tapered through hole having a first diameter opening at one end thereof, in one surface of the first and second opposing surfaces, larger than a second diameter opening at another end thereof, in another surface of the first and second opposing surfaces;
a plating layer disposed on an inner surface of the tapered through hole of the core layer and on only the one surface, from among the first and second opposing surfaces, having the first diameter opening of the through hole;
a metal layer disposed on only the one surface, from among the first and second opposing surfaces of the core layer, having the first diameter opening of the through hole, and the metal layer having an opening aligned with the through hole and having a width greater than a width of the through hole such that the metal layer is spaced apart from the through hole and in contact with the plating layer disposed on the one surface;
a via disposed in the through hole; and
first and second connection pads distinct from the metal layer, disposed on opposing ends of the via, and each extending externally from a respective one of the first and second opposing surfaces of the core layer.