US 10,485,092 B2
Multilayer bus board
Richard Schneider, Livonia, MI (US); and Joseph J. Lynch, East Northport, NY (US)
Assigned to INTERPLEX INDUSTRIES, INC., East Providence, RI (US)
Appl. No. 15/552,116
Filed by Richard Schneider, Livonia, MI (US); Joseph J. Lynch, East Northport, NY (US); and INTERPLEX INDUSTRIES, INC., College Point, NY (US)
PCT Filed Feb. 16, 2016, PCT No. PCT/US2016/018000
§ 371(c)(1), (2) Date Aug. 18, 2017,
PCT Pub. No. WO2016/133861, PCT Pub. Date Aug. 25, 2016.
Claims priority of provisional application 62/153,710, filed on Apr. 28, 2015.
Claims priority of provisional application 62/117,705, filed on Feb. 18, 2015.
Prior Publication US 2018/0049310 A1, Feb. 15, 2018
Int. Cl. H05K 1/02 (2006.01); H02G 5/00 (2006.01); H01R 12/52 (2011.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0209 (2013.01) [H01R 12/526 (2013.01); H02G 5/005 (2013.01); H05K 1/18 (2013.01); H05K 3/429 (2013.01); H05K 3/4679 (2013.01); H05K 2201/01 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/10242 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/2018 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer bus board comprising:
a multilayer stacked assembly having a plurality of layers including a pair of electrically conductive layers and a dielectric layer disposed between and adjoining each of the conductive layers; and
a molded frame formed of an insulating polymer material, the frame having a peripheral portion encapsulating end portions of the dielectric layer and the conductive layers to maintain the conductive layers and the dielectric layer in position relative to each other, the frame defining an enlarged opening through which an external surface of an outer one of the layers is exposed.