CPC H01L 23/5385 (2013.01) [H01L 23/31 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 25/0657 (2013.01)] | 20 Claims |
1. A semiconductor die assembly, comprising:
a first semiconductor die including a first side and a second side opposite to the first side;
one or more second semiconductor dies attached to the first side, the one or more second semiconductor dies operatively coupled to the first semiconductor die; and
a biodegradable structure attached to the second side, the biodegradable structure including a conductive material operatively coupled to the first semiconductor die and an insulating material, wherein both the conductive material and the insulating material are biodegradable and configured to disintegrate in a wet process.
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