US 11,817,367 B2
Power module
Jens Schmenger, Forchheim (DE); Roman Kögler, Nuremberg (DE); Thomas Schwinn, Herzogenaurach (DE); and Bernd Roppelt, Unterhaid (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Filed by Siemens Aktiengesellschaft, Munich (DE)
Filed on Jan. 13, 2023, as Appl. No. 18/096,997.
Claims priority of application No. 22151767 (EP), filed on Jan. 17, 2022.
Prior Publication US 2023/0230894 A1, Jul. 20, 2023
Int. Cl. H01L 23/367 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01); H01L 23/32 (2006.01)
CPC H01L 23/367 (2013.01) [H01L 23/32 (2013.01); H05K 7/1432 (2013.01); H05K 7/209 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A power module, comprising:
a heat sink;
a power unit formed at least partially inside the heat sink and/or on the heat sink and comprising a semiconductor element and a substrate; and
a device designed to enclose the power unit and to center a control unit with respect to the power unit, said device comprising a frame designed to surround the substrate at least partially, preferably completely, a first projecting section designed to engage in a recess or an opening of the heat sink, and a second projecting section designed to engage in a recess or an opening or a notch of the control unit and to have an outline which when viewed in cross-section is at least essentially star-shaped with at least a first leg, a second leg and a third leg.