CPC H01L 23/367 (2013.01) [H01L 23/32 (2013.01); H05K 7/1432 (2013.01); H05K 7/209 (2013.01)] | 20 Claims |
1. A power module, comprising:
a heat sink;
a power unit formed at least partially inside the heat sink and/or on the heat sink and comprising a semiconductor element and a substrate; and
a device designed to enclose the power unit and to center a control unit with respect to the power unit, said device comprising a frame designed to surround the substrate at least partially, preferably completely, a first projecting section designed to engage in a recess or an opening of the heat sink, and a second projecting section designed to engage in a recess or an opening or a notch of the control unit and to have an outline which when viewed in cross-section is at least essentially star-shaped with at least a first leg, a second leg and a third leg.
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