US 11,817,266 B2
Conductive paste and ceramic electronic component
Kenichi Hamanaka, Nagaokakyo (JP); and Kota Zenzai, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Mar. 2, 2022, as Appl. No. 17/684,556.
Claims priority of application No. 2021-040739 (JP), filed on Mar. 12, 2021.
Prior Publication US 2022/0293345 A1, Sep. 15, 2022
Int. Cl. H01G 4/232 (2006.01); H01B 1/22 (2006.01); C22C 9/06 (2006.01); B22F 1/103 (2022.01); B22F 1/17 (2022.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [B22F 1/103 (2022.01); B22F 1/17 (2022.01); C22C 9/06 (2013.01); H01B 1/22 (2013.01); B22F 2304/10 (2013.01); H01G 4/30 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A conductive paste comprising:
a conductive metal powder; and
a curable resin; wherein
the conductive metal powder primarily includes only Ag and CuNi alloy;
a mass ratio of the Ag in the conductive metal powder is about 3.0 wt % or more and about 10.0 wt % or less;
a mass ratio of the Cu in the conductive metal powder is about {(1−mass ratio of Ag/100)×70} wt % or more and about {(1−mass ratio of Ag/100)×95} wt % or less; and
a mass ratio of the Ni in the conductive metal powder is about {(1−mass ratio of Ag/100)×5} wt % or more and about {(1−mass ratio of Ag/100)×30} wt % or less.