CPC H01G 4/2325 (2013.01) [B22F 1/103 (2022.01); B22F 1/17 (2022.01); C22C 9/06 (2013.01); H01B 1/22 (2013.01); B22F 2304/10 (2013.01); H01G 4/30 (2013.01)] | 15 Claims |
1. A conductive paste comprising:
a conductive metal powder; and
a curable resin; wherein
the conductive metal powder primarily includes only Ag and CuNi alloy;
a mass ratio of the Ag in the conductive metal powder is about 3.0 wt % or more and about 10.0 wt % or less;
a mass ratio of the Cu in the conductive metal powder is about {(1−mass ratio of Ag/100)×70} wt % or more and about {(1−mass ratio of Ag/100)×95} wt % or less; and
a mass ratio of the Ni in the conductive metal powder is about {(1−mass ratio of Ag/100)×5} wt % or more and about {(1−mass ratio of Ag/100)×30} wt % or less.
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