US 11,815,748 B2
Optoelectronic device
James Dongyoon Oh, Alhambra, CA (US); Hooman Abediasl, Thousand Oaks, CA (US); Gerald Cois Byrd, Shadow Hills, CA (US); Karlheinz Muth, Richardson, TX (US); Yi Zhang, Pasadena, CA (US); and Aaron John Zilkie, Pasadena, CA (US)
Assigned to Rockley Photonics Limited, Altrincham (GB)
Filed by ROCKLEY PHOTONICS LIMITED, Altrincham (GB)
Filed on Dec. 2, 2021, as Appl. No. 17/540,782.
Application 17/540,782 is a continuation of application No. 16/281,035, filed on Feb. 20, 2019, granted, now 11,209,678.
Claims priority of application No. 1802763 (GB), filed on Feb. 21, 2018.
Prior Publication US 2022/0163824 A1, May 26, 2022
Int. Cl. G02F 1/01 (2006.01); G02F 1/035 (2006.01); G02F 1/295 (2006.01); G02B 6/10 (2006.01); G02F 1/025 (2006.01); G02F 1/015 (2006.01)
CPC G02F 1/025 (2013.01) [G02F 1/0157 (2021.01); G02F 2201/063 (2013.01); G02F 2203/21 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An optoelectronic device, including:
a rib waveguide, the rib waveguide including:
a ridge portion, which includes a temperature-sensitive optically active region, and
a slab portion, positioned adjacent to the ridge portion;
wherein the optoelectronic device further comprises:
a heater, for heating the temperature-sensitive optically active region;
a bottom cladding layer, disposed adjacent to the slab portion; and
a thermal isolation cavity, located on an opposing side of the bottom cladding layer to the slab portion, and
wherein a part of the heater closest to the ridge portion is at least 2 μm away from the ridge portion.