CPC B29C 45/376 (2013.01) [B29C 45/14065 (2013.01); H02K 15/12 (2013.01); B29L 2031/7498 (2013.01)] | 9 Claims |
1. A mold for encapsulating or overmolding a component, comprising:
an arrangement space which extends along a longitudinal axis and is designed for the arrangement and for the encapsulation or overmolding of the component,
wherein the arrangement space is delimited at least sectionally by at least one adjustment tool, the position of which is adjustable in such a manner that a size of the arrangement space is changeable; and
a cavity insert for arrangement of the component being encapsulated,
wherein the cavity insert is arranged in a mold arrangement of the injection mold, the cavity insert comprises two insertion elements, and a plug-in connector is provided for the connection and closure of the insertion elements.
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