US 10,477,701 B2
Circuit board and method for manufacturing the same
Po-Hsuan Liao, Taoyuan (TW); and Wen-Fang Liu, Taoyuan (TW)
Assigned to UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Dec. 11, 2017, as Appl. No. 15/836,937.
Claims priority of application No. 106136764 A (TW), filed on Oct. 25, 2017.
Prior Publication US 2019/0124778 A1, Apr. 25, 2019
Int. Cl. H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 21/02 (2006.01); H01L 21/31 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/70 (2006.01); H01L 21/768 (2006.01); H01L 21/4763 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H05K 3/38 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01)
CPC H05K 3/386 (2013.01) [H05K 1/036 (2013.01); H05K 1/115 (2013.01); H05K 3/002 (2013.01); H05K 3/0023 (2013.01); H05K 3/0041 (2013.01); H05K 3/107 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0195 (2013.01); H05K 2203/0522 (2013.01); H05K 2203/1453 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A circuit board, comprising:
a substrate comprising a metal-containing board, a ceramic-containing board, or an organic-containing board;
a first dielectric layer disposed on the substrate;
a conductive layer between the substrate and the first dielectric layer;
an adhesive layer bonded to the first dielectric layer and having a first through hole;
a second dielectric layer disposed on the adhesive layer and having a second through hole communicated with the first through hole;
a conductive line located in the first through hole of the adhesive layer and the second through hole of the second dielectric layer and in contact with a top surface of the first dielectric layer; and
a conductive contact passing through the first and second dielectric layers and in contact with a top surface of the conductive layer and the adhesive layer.