US D1,004,142 S
Wood grain pattern for simulated wood flooring planks
Biao Wang, Shanghai (CN); and Jason Pyon, Feasterville-Trevose, PA (US)
Assigned to Durato International, Langhorne, PA (US)
Filed by Durato International, Langhorne, PA (US)
Filed on Jul. 8, 2020, as Appl. No. 29/740,894.
Term of patent 15 Years
LOC (14) Cl. 25 - 01
U.S. Cl. D25—150
OG exemplary drawing
 
The ornamental design of a wood grain pattern for simulated wood flooring planks, as shown and described.