US 11,812,585 B2
Rack-mountable heat-exchanger for modular electronic systems
Rohit Dev Gupta, Bangalore (IN); Manigandan Boopalan, Bangalore (IN); Arjun G. Jayaprakash, Bengaluru (IN); and Parag Ghate, Bengaluru (IN)
Assigned to Cisco Technology, Inc., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Aug. 19, 2021, as Appl. No. 17/445,470.
Claims priority of application No. 202041055805 (IN), filed on Dec. 22, 2020.
Prior Publication US 2022/0201901 A1, Jun. 23, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20736 (2013.01) [H05K 7/20145 (2013.01); H05K 7/20836 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a heat exchanger including an ambient air inlet and an ambient air outlet forming an ambient airflow path in a first direction, and a recirculating air inlet and a recirculating air outlet forming a recirculating airflow path in a second direction perpendicular to the first direction, wherein the ambient airflow path is separated from the recirculating airflow path;
housing for an electronic device, the housing including an internal air inlet and an internal air outlet forming an internal airflow path;
a first duct configured to link the recirculating air outlet to the internal air inlet;
a second duct configured to link the recirculating air inlet to the internal air outlet;
an ambient air fan assembly located in the ambient airflow path, configured to propel ambient air through the heat exchanger in the ambient airflow path; and
a recirculating air fan assembly located in the recirculating airflow path, configured to propel air through the heat exchanger in the recirculating airflow path.