US 11,812,584 B2
Heat spreader device
Svitlana Trygubova, Lakewood, CO (US)
Assigned to DISH Technologies L.L.C., Englewood, CO (US)
Filed by DISH TECHNOLOGIES L.L.C., Englewood, CO (US)
Filed on Jun. 9, 2020, as Appl. No. 16/896,616.
Application 16/896,616 is a division of application No. 15/729,866, filed on Oct. 11, 2017, granted, now 10,721,840.
Prior Publication US 2020/0305304 A1, Sep. 24, 2020
Int. Cl. H05K 7/20 (2006.01); F28F 9/00 (2006.01); F28F 3/00 (2006.01); H05K 5/00 (2006.01)
CPC H05K 7/2049 (2013.01) [F28F 3/00 (2013.01); F28F 9/002 (2013.01); H05K 5/0004 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A heat spreader, configured to operatively dissipate heat from a heat generating device component, comprising:
a heat plate-comprising:
a top surface including at least a first location, a second location, and a third location; and
a spring comprising:
a first spring member; and
a second spring member;
wherein the first spring member is attached to the heat plate at the first location;
wherein the second spring member attaches the spring to the heat plate at the second location, when the spring is compressed by the heat generating device component; and
wherein the second spring member attaches the spring to the heat plate at the third location, when the spring is not compressed by the heat generating device component.