CPC H05K 7/2049 (2013.01) [F28F 3/00 (2013.01); F28F 9/002 (2013.01); H05K 5/0004 (2013.01)] | 20 Claims |
1. A heat spreader, configured to operatively dissipate heat from a heat generating device component, comprising:
a heat plate-comprising:
a top surface including at least a first location, a second location, and a third location; and
a spring comprising:
a first spring member; and
a second spring member;
wherein the first spring member is attached to the heat plate at the first location;
wherein the second spring member attaches the spring to the heat plate at the second location, when the spring is compressed by the heat generating device component; and
wherein the second spring member attaches the spring to the heat plate at the third location, when the spring is not compressed by the heat generating device component.
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