US 11,812,557 B2
Electrical device, interlayer ply including an electrical device and methods for making said electrical device and interlayer ply
Stephen Roland Day, Wigan (GB)
Assigned to PILKINGTON GROUP LIMITED, Lancashire (GB)
Appl. No. 17/273,249
Filed by Pilkington Group Limited, Nr. Ormskirk (GB)
PCT Filed Sep. 4, 2019, PCT No. PCT/GB2019/052455
§ 371(c)(1), (2) Date Mar. 3, 2021,
PCT Pub. No. WO2020/049292, PCT Pub. Date Mar. 12, 2020.
Claims priority of application No. 1814347 (GB), filed on Sep. 4, 2018.
Prior Publication US 2021/0329787 A1, Oct. 21, 2021
Int. Cl. H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01)
CPC H05K 1/187 (2013.01) [H05K 1/147 (2013.01); H05K 3/0097 (2013.01); H05K 3/284 (2013.01); H05K 2201/09754 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10151 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of making an electrical device comprising:
(i) providing a layer of interlayer material having a first major surface and a second opposing major surface;
(ii) positioning at least a first electrically operable component on the first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board; and
(iii) providing a layer of adhesive material to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and/or at least a portion of the first circuit board
such that following (iii) the first electrically operable component is fixed on the layer of interlayer material by at least a portion of the layer of adhesive material,
wherein following (ii) at least a second electrically operable component is positioned on the layer of interlayer material, the second electrically operable component being mounted on a second circuit board, further wherein the second electrically operable component is spaced apart from the first electrically operable device and/or the first circuit board is spaced apart from the second circuit board.