US 11,812,550 B2
Embedding method of a flat heat pipe into PCB for active device cooling
Feng Zhou, Ann Arbor, MI (US); and Ercan Mehmet Dede, Ann Arbor, MI (US)
Assigned to Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US)
Filed by Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US)
Filed on Feb. 3, 2021, as Appl. No. 17/166,205.
Claims priority of provisional application 63/107,714, filed on Oct. 30, 2020.
Prior Publication US 2022/0141951 A1, May 5, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0272 (2013.01) [H05K 1/185 (2013.01); H05K 3/30 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A system comprising:
a PCB stack comprising a first major substrate opposite a second major substrate;
a pre-preg layer disposed between the first and second major substrates;
a power device stack embedded within the PCB stack and comprising a substrate;
a power device coupled to the substrate of each power device stack, the substrate of each power device stack comprising a cavity for receiving the power device; and
a flat heat pipe having a first end embedded in the PCB stack and a second end extending outside the PCB stack, the power device stack being coupled to the flat heat pipe.