CPC H05K 1/0272 (2013.01) [H05K 1/185 (2013.01); H05K 3/30 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01)] | 19 Claims |
1. A system comprising:
a PCB stack comprising a first major substrate opposite a second major substrate;
a pre-preg layer disposed between the first and second major substrates;
a power device stack embedded within the PCB stack and comprising a substrate;
a power device coupled to the substrate of each power device stack, the substrate of each power device stack comprising a cavity for receiving the power device; and
a flat heat pipe having a first end embedded in the PCB stack and a second end extending outside the PCB stack, the power device stack being coupled to the flat heat pipe.
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