US 11,812,547 B2
Memory module for protection of a circuit, a memory module protection device, and a memory module protection system
Dongyoon Seo, Seoul (KR); Sangkeun Kwak, Seoul (KR); Dohyung Kim, Seoul (KR); Kyeongseon Park, Seoul (KR); Hwanwook Park, Seoul (KR); Wonseop Lee, Daegu (KR); and Daae Heo, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 24, 2021, as Appl. No. 17/356,940.
Claims priority of application No. 10-2020-0112634 (KR), filed on Sep. 3, 2020.
Prior Publication US 2022/0070999 A1, Mar. 3, 2022
Int. Cl. H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/0263 (2013.01) [H05K 1/0296 (2013.01); H05K 1/142 (2013.01); H05K 2201/10159 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory module, comprising:
a first printed circuit board having first and third edges opposite each other and second and fourth edges opposite each other;
a first socket and a second socket;
a plurality of sockets disposed between the first socket and the second socket, wherein the plurality of sockets and the first and second sockets are disposed at the first edge; and
a daisy chain pattern formed in a first region of the first printed circuit board and connected to the first socket and the second socket, wherein the daisy chain pattern extends from the first socket along the second edge, the third edge and the fourth edge to the second socket, and
wherein an electrical signal on the daisy chain pattern is transferred to a host device when the first socket and the second socket are connected to the host device.