CPC H05K 1/0263 (2013.01) [H05K 1/0296 (2013.01); H05K 1/142 (2013.01); H05K 2201/10159 (2013.01)] | 20 Claims |
1. A memory module, comprising:
a first printed circuit board having first and third edges opposite each other and second and fourth edges opposite each other;
a first socket and a second socket;
a plurality of sockets disposed between the first socket and the second socket, wherein the plurality of sockets and the first and second sockets are disposed at the first edge; and
a daisy chain pattern formed in a first region of the first printed circuit board and connected to the first socket and the second socket, wherein the daisy chain pattern extends from the first socket along the second edge, the third edge and the fourth edge to the second socket, and
wherein an electrical signal on the daisy chain pattern is transferred to a host device when the first socket and the second socket are connected to the host device.
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