CPC H05K 9/0083 (2013.01) [B32B 27/18 (2013.01); C09D 5/24 (2013.01); C09D 7/61 (2018.01); C09D 7/69 (2018.01); H05K 1/023 (2013.01); H05K 1/0215 (2013.01); H05K 9/00 (2013.01); H05K 1/181 (2013.01); H05K 2201/0715 (2013.01)] | 5 Claims |
1. An electromagnetic wave shielding film comprising:
an insulating layer having electrical insulation properties;
a conductive layer having stretchability;
an adhesion layer formed on one surface of the conductive layer and having insulating properties;
a through-hole extending only from a surface of the insulating layer to a surface of the conductive layer, which is in direct contact with the insulating layer; and
a pad electrically connected to the conductive layer and formed directly on the insulating layer, wherein
the conductive layer includes a conductive composition comprising a resin having stretchability and a conductive filler filled with the resin; wherein the conductive filler is dendritic, and
the resin has a tensile permanent set of 2.5% or more and 90% or less.
|