US 11,812,218 B1
Concurrent audio and haptics from a single mechanical transducer
Philip Clarkin, Austin, TX (US); Itisha Tyagi, Austin, TX (US); and Kaichow Lau, Austin, TX (US)
Assigned to Cirrus Logic Inc., Austin, TX (US)
Filed by Cirrus Logic International Semiconductor Ltd., Edinburgh (GB)
Filed on Oct. 3, 2019, as Appl. No. 16/592,164.
Claims priority of provisional application 62/744,749, filed on Oct. 12, 2018.
Int. Cl. H04R 1/28 (2006.01); H04R 9/06 (2006.01); G06F 3/01 (2006.01); G06F 3/16 (2006.01)
CPC H04R 1/2803 (2013.01) [G06F 3/016 (2013.01); G06F 3/167 (2013.01); H04R 9/06 (2013.01); H04R 2400/03 (2013.01); H04R 2499/11 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A system comprising:
a vibrating surface;
a single mechanical transducer mechanically coupled to the vibrating surface;
a signal processing subsystem configured to receive an audio signal and a haptic signal, process the audio signal and the haptic signal to generate a combined audio-haptic signal, and drive the combined audio-haptic signal to the single mechanical transducer in order to generate concurrent audio playback and haptic effects on the vibrating surface; and
a control subsystem configured to, responsive to a stimulus for generating haptic effects on the vibrating surface, other than haptic feedback from the vibrating surface, modify at least one parameter of at least one of the audio signal and the haptic signal to accommodate the concurrent audio playback and haptic effects on the vibrating surface within at least one operational limit of the system.