CPC H04N 23/54 (2023.01) [G03B 17/14 (2013.01); H04N 23/55 (2023.01)] | 19 Claims |
1. A sensor device comprising:
a housing comprising a front plate and a back plate; and
a printed circuit board encased by the housing, wherein the printed circuit board comprises:
an image sensor;
an image sensor processor;
conducting layers interposed between insulating layers, wherein a conducting layer of the conducting layers comprises power planes, wherein one of the power planes is connected to a decoupling capacitor that carries power to the image sensor or the image sensor processor; and
heat conducting channels that extend through a depth of the printed circuit board and penetrate through the conducting layers and the insulating layers.
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